MOSAID’s Semiconductor Process Portfolio includes core technologies applicable to a wide range of manufacturing methods and physical structures of semiconductor memory and processor products.
Memory Process Patents
MOSAID’s Memory Process patents were selected and acquired from the world’s top semiconductor memory manufacturers, and apply to state-of-the-art DRAM and Flash memory devices, such as advanced 3D NAND Flash memory devices. In addition, our portfolio also includes patents applicable to CMOS image sensor products, covering a wide range of current pixel array technologies for both Front Side and Back Side illuminated CMOS image sensors.
Logic Process Patents
MOSAID’s Logic Process patent portfolio includes patents related to the manufacture of semiconductor processors that are ubiquitous at the heart of all digital products including consumer products such as personal computers and smartphones.
Important technologies covered by our patents are Front End-Of-Line (FEOL) processes and structures particularly related to transistor devices; and Back End-Of-Line (BEOL) processes related to metal interconnections, dielectric isolation layers and chip passivation. A significant portion of the Logic portfolio deals with advanced processor technologies such as High-K Metal Gate (HKMG), 3D transistors or FinFET, as well as advanced metallization processes.
Complementing our Memory and Logic portfolios, our Packaging portfolio comprises patents related to the final stage of fabricating an integrated circuit component, in which the semiconductor chip is encased in a protective package.
MOSAID’s Packaging patents cover various types of widely used packaging technologies, including Ball Grid Array (BGA), flip-chip, and System-in-Package (SiP). The patents also cover emerging packaging technologies such as 3D IC, in which two or more electronic components are integrated both vertically and horizontally into a single package.